RT/duroid® 5880 High Frequency Laminates are PTFE glass fiber reinforced composites. The micro-glass fibers are randomly oriented within the material, providing maximum strength enhancement for both circuit application and production processes.
These high-frequency materials possess one of the lowest dielectric constants among similar materials. Their extremely low dissipation factor makes them exceptionally suitable for high-frequency and broad-band applications requiring minimized dispersion and loss. Additionally, the very low moisture absorption of RT/duroid® 5880 makes it an ideal choice for applications in high-humidity environments.
RT/duroid 5880 is easily cut into required shapes and resists attack by all solutions and reagents used in etching and plated-through-hole processes. RT/duroid 5870 and 5880 laminates feature the lowest dissipation factor available in reinforced PTFE materials, low moisture absorption, isotopic properties, and electrical characteristics that exhibit minimal change with frequency.
To meet the increasingly stringent demands of high-frequency circuit design, ROGERS introduced the next-generation high-frequency laminate, RT/duroid® 5880. Manufactured from PTFE glass fiber reinforced material, the micro-fibers within the laminate are randomly distributed, significantly ensuring strength requirements during both circuit application and production processes. Compared to similar materials on the market, RT/duroid® 5880 offers one of the lowest dielectric constants, measuring 2.20 ± 0.02 at 10GHz per IPC-TM 2.5.5.5. Under the same standard, its dissipation factor is only 0.0009. This extremely low loss makes it highly suitable for high-frequency and broadband applications where minimizing dispersion and loss is critical, supporting operating frequencies up to Ku-band and even higher. Furthermore, RT/duroid® 5880 features very low moisture absorption of only 0.02%, making it ideal for use in high-humidity environments.
RT/duroid 5880 is easily cut into required shapes, perfectly adapting to the various cavity structure requirements for printed circuit boards in high-frequency applications. Moreover, as a high-frequency laminate, RT/duroid 5880 supports electro-deposited copper cladding with thicknesses from 8 to 70 μm. This laminate resists attack by various acidic and alkaline reagents used in processing and withstands high and low-temperature processing steps. RT/duroid 5870, with its lowest dissipation factor among reinforced PTFE materials, low moisture absorption, isotopic nature, and stable electrical properties over frequency, is used in commercial airline telephone circuits, microstrip and stripline circuits, millimeter-wave applications, military radar systems, missile guidance systems, and point-to-point digital radio antennas.
Key Features of RT/duroid® 5880 Laminates:
- Extremely low dielectric constant: 2.20 ± 0.02 @ 10 GHz per IPC-TM 2.5.5.5
- Extremely low dissipation factor: 0.0009 @ 10 GHz per IPC-TM 2.5.5.5
- Supports high-frequency applications up to Ku-band and beyond
- Low moisture absorption: 0.02%
- Compatible with lead-free assembly processes
Rogers RT/duroid 5880 High Frequency Laminates are used in:
- Commercial Airline Telephone Circuits
- Microstrip and Stripline Circuits
- Millimeter-wave Applications
- Military Radar Systems
- Missile Guidance Systems
- Point-to-Point Digital Radio Antennas