Xincheng’er Electronics has over 15 years of experience manufacturing high-frequency, microwave, and RF printed circuit boards (PCBs). Our extensive portfolio of PTFE and ceramic-based laminates and substrates ensures that engineers and designers can find the optimal material for both prototyping and mass production.
Whether you are developing advanced RF circuits or high-speed communication boards, our F4B materials are designed to deliver consistent performance, low dielectric loss, and superior thermal stability.
1. PTFE Glass Fiber Cloth Copper-Clad Laminates: F4B Series
- F4B255, F4B265
These standard F4B laminates offer excellent high-frequency performance and can be used in a wide range of RF applications.
2. PTFE Glass Fiber Cloth Copper-Clad Laminates: F4BM Series
- F4BM217, F4BM220, F4BM233, F4BM245, F4BM255, F4BM265, F4BM275, F4BM294, F4BM300
The F4BM series combines PTFE with reinforced glass fabric for improved mechanical strength and low dielectric loss, making it ideal for multilayer RF boards.
3. PTFE Glass Fiber Cloth Copper-Clad Laminates: F4BME Series
- F4BME217, F4BME220, F4BME233, F4BME245, F4BME255, F4BME265, F4BME275, F4BME294, F4BME300
F4BME laminates are engineered for high-frequency circuits requiring ultra-stable dielectric properties, ensuring reliable performance in demanding environments.
4–5. PTFE Glass Fabric Ceramic-Filled Substrates: F4BTM & F4BTME Series
- F4BTM298, F4BTM300, F4BTM320, F4BTM350
- F4BTME298, F4BTME300, F4BTME320, F4BTME350
These ceramic-filled PTFE substrates provide superior thermal conductivity and reduced dielectric constant variation, perfect for microwave and RF applications.
6–7. PTFE Glass Fabric Ceramic Film Substrates: F4BM-2-A & F4BME-2-A Series
- F4BM-2-A255, F4BM-2-A265, F4BM-2-A294, F4BM-2-A300
- F4BME-2-A255, F4BME-2-A265, F4BME-2-A294, F4BME-2-A300
These materials feature ultra-thin ceramic films for enhanced high-frequency performance and compact circuit designs.
8. PTFE Ultra-Thin, Ultra-Fine Glass Fabric Ceramic-Filled Substrates: F4BTMS Series
- F4BTMS220, F4BTMS233, F4BTMS255, F4BTMS265, F4BTMS294, F4BTMS300, F4BTMS350, F4BTMS430, F4BTMS450, F4BTMS615, F4BTMS1000
F4BTMS series is engineered for ultra-fine RF circuits requiring minimal signal loss and consistent impedance.
9. PTFE-Ceramic Composite Dielectric Substrates: TFA Series
- TFA294, TFA300, TFA615, TFA1020
These composites are ideal for microwave frequency circuits, offering a perfect balance between mechanical strength and dielectric performance.
10–12. Advanced Organic and Ceramic Bonding Materials
- WL-CT Series Copper-Clad Laminates: WL-CT300, WL-CT330, WL-CT330Z, WL-CT338, WL-CT350, WL-CT440, WL-CT615
- WL-PP Hydrocarbon Ceramic Glass Fiber Cloth Bonding Sheets: WL-PP300, WL-PP350
- WL-PP Ceramic Composite Film Bonding Sheets: WL-PP280-50N, WL-PP280-50H
These bonding sheets are designed for multilayer PCBs, providing reliable adhesion and thermal stability.
13–14. Microwave and PTFE-Ceramic Dielectric Laminates: TP & TF Series
- TP, TP-1, TP-2
- TF, TF-1, TF-2
These laminates are optimized for microwave applications, with excellent signal integrity and low insertion loss.
15. Polytetrafluoroethylene (PTFE) Glass-Coated Cloth
- F4B-N, F4B-T, TWH002
Our PTFE glass-coated cloth provides high durability and consistent dielectric properties for RF boards with high reliability requirements.
Why Choose Xincheng’er Electronics
- 15+ Years of Expertise: Specialized in RF and microwave PCB production.
- Prototype & Mass Production: Flexible manufacturing for different project scales.
- Quality Assurance: Rigorous testing ensures material consistency.
- Global Reach: Supplying high-performance PCBs to clients worldwide.
For more details on high-frequency laminates, visit our PCB materials page or learn about RF PCB design tips
Frequently Asked Questions (Q&A)
What is the difference between F4B and F4BM laminates?
F4B is a standard PTFE glass fiber laminate, while F4BM includes additional reinforcement for better mechanical strength and stability in high-frequency applications.
Can these PTFE substrates be used for multilayer PCBs?
Yes, series like F4BM-2-A, F4BME-2-A, and WL-PP bonding sheets are specifically designed for multilayer high-frequency PCBs.
Which materials are best for microwave applications?
F4BTM, F4BTME, TFA, TP, and TF series offer optimal performance for microwave circuits due to their stable dielectric properties and low signal loss.
How do I choose the right substrate for my RF PCB?
Consider dielectric constant, loss tangent, thermal conductivity, and mechanical strength. Our experts at Xincheng'er can help you select the ideal material for your project.