Parameters and Details of Rogers 4350B of Different Thicknesses

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Table of Contents
  1. Overview of Rogers 4350B
    Rogers RO4350B is a low-loss and high-reliability laminate designed specifically for high-frequency applications. It is widely used in RF, microwave communications, and automotive radar applications. Compared to traditional PTFE substrates, RO4350B offers better processability and cost-efficiency while maintaining superior high-frequency performance.
  2. Key Parameters for Different Thicknesses
    Dielectric Constant (Dk):

    Typical value: 3.48 (±0.05) measured at 10 GHz.
    Minimal variation with thickness ensures accurate impedance control.
    Dissipation Factor (Df):
    At 10 GHz: 0.0037.
    Consistently low Df ensures high-quality signal transmission regardless of board thickness.
    Available Thicknesses:
    Standard options:
    0.1016 mm (4 mil)
    0.2032 mm (8 mil)
    0.254 mm (10 mil)
    0.508 mm (20 mil)
    0.762 mm (30 mil)
    1.524 mm (60 mil)
    Thinner boards suit miniaturized designs, while thicker boards are ideal for high-power and multilayer applications.
    Thermal Expansion Coefficient (CTE):
    X and Y directions: 11 ppm/°C, closely matching copper for strong thermal compatibility.
    Z direction: 32 ppm/°C, minimizing risks of delamination or pad cracking.
    Thermal Conductivity:
    Typical value: 0.62 W/m·K, suitable for effective heat dissipation in high-power devices.
    Water Absorption:
    Low water absorption of 0.06%, ensuring stable electrical performance in humid environments.
    Copper Foil Type and Surface Roughness:
    Options include standard copper foil and low-profile LoPro copper foil to meet insertion loss requirements.
    Flammability Rating:
    UL 94 V-0 compliant for excellent safety and flame resistance.
    Long-Term Stability and Environmental Resistance:
    Performs exceptionally in high-temperature and high-humidity conditions, making it ideal for automotive and industrial applications.
  3. Applications Based on Thickness
    5G Communications and Wireless Base Stations:
    Thin Boards (0.1016 mm ~ 0.254 mm):
    Used in antenna feedlines, high-frequency filters, and power amplifiers.
    Thick Boards (0.508 mm ~ 1.524 mm):
    Suitable for power distribution networks and multilayer base station PCBs.
    Automotive Radar:
    Commonly used in 77 GHz millimeter-wave radar with 0.2032 mm and 0.508 mm thicknesses.
    High-Frequency RF and Microwave Circuits:
    Thin Boards:
    Ideal for high-frequency transmission lines.
    Thick Boards:
    Suitable for RF power distribution, low-pass filters, and mixers.
    Satellite Communication and Radar Systems:
    0.508 mm boards perform well in RF satellite communication modules.
    Industrial Control and Sensors:
    RO4350B is reliable for high-frequency sensors and industrial control systems.
    Multilayer High-Frequency Circuits:
    Thick Boards (>0.762 mm): Used as core materials combined with other low-loss substrates.
  4. Manufacturing Guidelines
    Cutting and Preparation:
    Use laser cutting or precision tools to avoid edge damage.
    Drilling and Plating:
    Adjust drilling speeds for thin and thick boards to prevent heat damage.
    Lamination and Shaping:
    Lamination temperatures: 175°C to 210°C with pressure adjustments for thicker boards.
    Impedance Control and Testing:
    Simulate impedance matching with tools like ADS or HFSS.
    Soldering and SMT:
    Employ low-temperature soldering to protect the material.

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