6-Layer 1st Order HDI FR4 TG180 PCB

Category

6-Layer 1st Order HDI FR4 TG180 PCB

1st order HDI plate with blind holes 1-2, 5-6 for corporate testing programs, the plate used is a regular high TG180 plate for better performance

其他信息

Board Thickness

Copper Thickness

Surface Finish

Solder Mask

Number of Layers

Price (unit)

3-6 dollars.

High TG180 FR4 sheet is an epoxy resin-based copper-clad sheet with high glass transition temperature (Tg) and flame retardant properties. Its Tg value reaches or exceeds 180°C, which means it can maintain good mechanical properties and dimensional stability at high temperatures. At the same time, the flame retardant properties of the FR4 grade enable it to meet the safety requirements of various electronic products.
High TG180 FR4 sheet is commonly used in the manufacture of temperature-sensitive electronics, for example:
High-performance computers: able to withstand higher temperatures during high load operation.
Automotive electronics: able to withstand the high temperatures found in automotive engine compartments.
Industrial control systems: Stable and reliable operation in harsh environments.
Aerospace: To meet the high reliability and high temperature requirements of aerospace materials.
High TG180 FR4 sheet has higher reliability and longer service life than ordinary FR4 sheet. Its excellent performance makes it the material of choice for the manufacture of many high-tech electronic products. However, the cost of High TG180 FR4 sheet is usually higher than that of regular FR4 sheet. Selection requires a trade-off between cost and performance based on the specific needs of the application.

Alron MATERIALS

Rogers MATERIALS

Wangling MATERIALS

Taconic MATERIALS

ISOla MATERIALS

Neclo MATERIALS

SHENGYI MATERIALS

We offer a variety of high-frequency materials, including Rogers (e.g., RO4350B, RO5880), Taconic, and PTFE, depending on customer requirements.

Absolutely, we can provide detailed datasheets for review.

Our high-frequency PCBs can support frequencies up to 110 GHz, depending on the design and materials used.

 We ensure precise impedance control through accurate stackup design, detailed impedance simulations, and advanced manufacturing processes.

Yes, we can combine materials like FR4 and high-frequency laminates for hybrid PCBs.

Restrictions mainly involve minimum trace width/spacing and material selection, depending on your design requirements.

We enhance thermal performance by using high thermal conductivity materials (e.g., metal-based PCBs) and optimizing copper thickness.

Thermal conductivity ranges from 0.2 W/m·K to 1.0 W/m·K, depending on the material.

ENIG/Gold Plating/Immersion Silver/Silver Plating/HASL/Gold finger/OSP/Nickel-palladium Gold/Resin plugging/Countersinking/ENIG+Hard Gold Plating/ImNi+ImTin/ENIG+OSP

ENIG is recommended due to its flat surface and excellent conductivity for high-frequency use.

We can produce high-frequency PCBs with layers ranging from 2 to 72.

Yes, we specialize in multilayer high-frequency PCBs and support hybrid stackup processes.

The thickness tolerance is ±0.05 mm, and the trace width tolerance is ±10%.

We perform impedance testing, RF performance testing, vacuum thermal testing, and more.

We achieve this by using high-quality materials, optimized manufacturing processes, and strict control of board thickness and other parameters.

Answer: Prototypes typically take 2–7 business days, while mass production takes 6–15 business days, depending on order volume and complexity.

High-frequency materials (e.g., Rogers) are more expensive, and higher layer counts increase complexity and cost.

We ensure reliability by using high-quality materials, rigorous testing, and optimized manufacturing processes.

Yes, our PCBs can endure temperatures up to 260°C and are suitable for harsh environments.

We use anti-static bags, vacuum packaging, and shockproof padding in the outer cartons for protection.

We provide air freight, express delivery, and sea shipping, depending on your needs, DHL is always prefered  that ensure timely delivery through reliable logistics.

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