6-layer HDI, Layer: 6-layer, Sheet: FR4 IT180A, Thickness: 1.6mm, Ink Colour: Black, Character Colour: White, Surface Technology: Immersion Gold, HDI Steps: 2, Minimum Drilling: 0.2mm, Test Points: 700, Hole Copper: 20um, Copper Thickness: Internal and external 1oz
| Number of Layers | |
|---|---|
| HDI steps | 2 |
| Board Thickness | |
| Copper Thickness | |
| Surface Finish |
Shenzhen Xin Chenger Electronics Co., Ltd. is mainly engaged in high-frequency microwave RF induction printed circuit board fast sample and small and medium batch strength manufacturers. Specialising in the production of high-frequency, high-precision, high-density environmentally friendly PCB circuit boards. Products mainly include: high frequency PCB circuit board, Rogers/Rogers high frequency board, Taconic/Taconic high frequency board, F4B/Teflon high frequency board, microwave radio frequency board, special circuit board, etc.. We have rich experience in the production of high-frequency circuit boards used in data communication, wireless communication base stations, radar systems, automotive, medical, military and other industries.
The company has domestic and imported high-frequency boards: Rogers (Rogers), Taconic (Taconic), Isola (Isola), F4B (Teflon), TP-2, FR4, etc., with a complete range of models and dielectric constants ranging from 2.2-10.6. We can provide 24-hour quick sample service in time to win business opportunities for customers. At the same time, our company has more than ten years of strong production experience, skilled craftsmanship, engineering technology and quality service. We have the advantages of high quality, low cost and foreign information technology support.
We offer a variety of high-frequency materials, including Rogers (e.g., RO4350B, RO5880), Taconic, and PTFE, depending on customer requirements.
Absolutely, we can provide detailed datasheets for review.
Our high-frequency PCBs can support frequencies up to 110 GHz, depending on the design and materials used.
We ensure precise impedance control through accurate stackup design, detailed impedance simulations, and advanced manufacturing processes.
Yes, we can combine materials like FR4 and high-frequency laminates for hybrid PCBs.
Restrictions mainly involve minimum trace width/spacing and material selection, depending on your design requirements.
We enhance thermal performance by using high thermal conductivity materials (e.g., metal-based PCBs) and optimizing copper thickness.
Thermal conductivity ranges from 0.2 W/m·K to 1.0 W/m·K, depending on the material.
ENIG/Gold Plating/Immersion Silver/Silver Plating/HASL/Gold finger/OSP/Nickel-palladium Gold/Resin plugging/Countersinking/ENIG+Hard Gold Plating/ImNi+ImTin/ENIG+OSP
ENIG is recommended due to its flat surface and excellent conductivity for high-frequency use.
We can produce high-frequency PCBs with layers ranging from 2 to 72.
Yes, we specialize in multilayer high-frequency PCBs and support hybrid stackup processes.
The thickness tolerance is ±0.05 mm, and the trace width tolerance is ±10%.
We perform impedance testing, RF performance testing, vacuum thermal testing, and more.
We achieve this by using high-quality materials, optimized manufacturing processes, and strict control of board thickness and other parameters.
Answer: Prototypes typically take 2–7 business days, while mass production takes 6–15 business days, depending on order volume and complexity.
High-frequency materials (e.g., Rogers) are more expensive, and higher layer counts increase complexity and cost.
We ensure reliability by using high-quality materials, rigorous testing, and optimized manufacturing processes.
Yes, our PCBs can endure temperatures up to 260°C and are suitable for harsh environments.
We use anti-static bags, vacuum packaging, and shockproof padding in the outer cartons for protection.
We provide air freight, express delivery, and sea shipping, depending on your needs, DHL is always prefered that ensure timely delivery through reliable logistics.
