Rogers 3003 is a glass-reinforced PTFE/cermaic composite laminate delivering stable electrical properties (Dk3.00, Df≈0.0013 @ 10 GHz) and low moisture absorption (<0.10%). Designed for cost-sensitive commercial RF applications, it offers excellent manufacturability using standard processes. Key uses include cellular base station antennas, automotive radar (24 GHz), point-to-point radios, and general RF components, providing a reliable balance of performance and affordability.
| Number of layers | 3L |
|---|---|
| Material | Rogers Ro3003 |
| Board Thickness | 1.804mm（71mil） |
| Copper Thickness | 1/1/1oz（35um） |
| Quanlity Standard | GJB362B |
| Dielectric Constant (Dk) | 3.00 @10GHz |
| Dissipation Factor (Df) | 0.0010 @10GHz |
| Applications | |
| Surface Finish | ENIG 2u |
Rogers 3003 High-Frequency Laminates
Rogers RO3003™ is a cost-effective, ceramic-filled, PTFE (polytetrafluoroethylene) composite laminate specifically engineered for commercial high-frequency applications requiring stable electrical properties and good processability. Key features include:
Low Dielectric Loss: Features a very low dissipation factor (Df ≈ 0.0013 at 10 GHz), minimizing signal attenuation for improved efficiency in RF circuits.
Stable Dielectric Constant: Offers a consistent relative dielectric constant (Dk ≈ 3.00 ± 0.04 at 10 GHz) across frequency and temperature variations, enabling predictable impedance control.
PTFE-Based System: Utilizes a woven glass reinforced PTFE composite structure, balancing electrical performance with mechanical stability and ease of fabrication using standard FR-4 processing techniques.
Excellent Thermal Stability: Maintains stable electrical properties over a wide operating temperature range (-50°C to +150°C).
Low Moisture Absorption: Exhibits low moisture uptake (<0.10%), contributing to reliable performance in humid environments.
Smooth Copper Surface: Provides good adhesion for copper foils and supports fine-line etching.
Cost-Effectiveness: Offers a strong price/performance ratio compared to more exotic high-frequency materials, making it suitable for volume production.
Primary Applications: Rogers 3003 is widely used in:
Cellular base station antennas (Sub-6 GHz, e.g., 3G/4G/5G)
Point-to-point radio links
Automotive radar sensors (e.g., 24 GHz)
RFID tags and readers
General-purpose RF components (filters, couplers, power dividers)
Aerospace and defense communication systems (where cost is a factor)
We offer a variety of high-frequency materials, including Rogers (e.g., RO4350B, RO5880), Taconic, and PTFE, depending on customer requirements.
Absolutely, we can provide detailed datasheets for review.
Our high-frequency PCBs can support frequencies up to 110 GHz, depending on the design and materials used.
We ensure precise impedance control through accurate stackup design, detailed impedance simulations, and advanced manufacturing processes.
Yes, we can combine materials like FR4 and high-frequency laminates for hybrid PCBs.
Restrictions mainly involve minimum trace width/spacing and material selection, depending on your design requirements.
We enhance thermal performance by using high thermal conductivity materials (e.g., metal-based PCBs) and optimizing copper thickness.
Thermal conductivity ranges from 0.2 W/m·K to 1.0 W/m·K, depending on the material.
ENIG/Gold Plating/Immersion Silver/Silver Plating/HASL/Gold finger/OSP/Nickel-palladium Gold/Resin plugging/Countersinking/ENIG+Hard Gold Plating/ImNi+ImTin/ENIG+OSP
ENIG is recommended due to its flat surface and excellent conductivity for high-frequency use.
We can produce high-frequency PCBs with layers ranging from 2 to 72.
Yes, we specialize in multilayer high-frequency PCBs and support hybrid stackup processes.
The thickness tolerance is ±0.05 mm, and the trace width tolerance is ±10%.
We perform impedance testing, RF performance testing, vacuum thermal testing, and more.
We achieve this by using high-quality materials, optimized manufacturing processes, and strict control of board thickness and other parameters.
Answer: Prototypes typically take 2–7 business days, while mass production takes 6–15 business days, depending on order volume and complexity.
High-frequency materials (e.g., Rogers) are more expensive, and higher layer counts increase complexity and cost.
We ensure reliability by using high-quality materials, rigorous testing, and optimized manufacturing processes.
Yes, our PCBs can endure temperatures up to 260°C and are suitable for harsh environments.
We use anti-static bags, vacuum packaging, and shockproof padding in the outer cartons for protection.
We provide air freight, express delivery, and sea shipping, depending on your needs, DHL is always prefered that ensure timely delivery through reliable logistics.
