Rogers RO4003C® is a high-performance, hydrocarbon ceramic laminate engineered for cost-sensitive RF/microwave and high-speed digital applications. It features an exceptional dielectric constant (D<sub>k</sub>) stability of 3.38 ±0.05 across frequencies and temperatures, combined with a low dissipation factor (D<sub>f</sub>) of 0.0027 at 10 GHz. Key advantages include compatibility with standard FR-4 multilayer processing, excellent thermal conductivity (0.71 W/m/K), near-zero moisture absorption (<0.06%), and a z-axis CTE closely matched to copper for reliable plated through-holes. RO4003C® delivers superior electrical consistency, thermal management, and manufacturing efficiency for antennas, automotive radars, wireless infrastructure, and high-reliability PCBs.
| Material | Rogers RO4003C + FR4 |
|---|---|
| Board Thickness | 1.6 mm (63 mil) |
| Copper Thickness | 1/0.5/0.5/1oz（35um） |
| Quanlity Standard | IPC-Ⅱ |
| Dielectric Constant (Dk) | 3.38 @10GHz + 4.2 @1GHz |
| Dissipation Factor (Df) | 0.0027@10GHz |
| Applications | Microwave Transceivers |
| Surface Finish | ENIG 3U |
Rogers Corporation's RO4003C® laminate is a high-frequency circuit material designed to bridge the performance gap between standard FR-4 and high-cost PTFE-based RF substrates. Utilizing a proprietary hydrocarbon ceramic reinforcement, this laminate offers an exceptional balance of electrical performance, thermal management, mechanical reliability, and cost-effectiveness.
At the core of RO4003C®'s value proposition is its outstanding dielectric stability. It maintains a consistent dielectric constant (D<sub>k</sub>) of 3.38 with tight tolerance (±0.05) over a wide frequency range (up to 40 GHz) and across operating temperatures (-50°C to +150°C). This minimizes phase variations critical for impedance control in high-frequency designs. Coupled with a low dissipation factor (D<sub>f</sub>) of 0.0027 at 10 GHz, RO4003C® ensures efficient signal transmission with minimal insertion loss, making it suitable for demanding RF and high-speed digital applications.
Beyond electrical performance, RO4003C® excels in thermal and mechanical reliability. Its z-axis coefficient of thermal expansion (CTE) is closely matched to copper (approximately 46 ppm/°C vs. copper's 17 ppm/°C), significantly enhancing plated through-hole (PTH) reliability during thermal cycling. The material exhibits excellent thermal conductivity (0.71 W/m/K), approximately double that of standard FR-4, enabling better heat dissipation in power applications. With extremely low moisture absorption (<0.06%), RO4003C® maintains stable performance in humid environments.
A major operational advantage is its compatibility with standard FR-4 multilayer board fabrication processes – including epoxy-based prepregs, mechanical drilling, and lead-free assembly – without requiring specialized PTFE treatments. This reduces manufacturing complexity and cost while enabling seamless integration of RF and digital sections in mixed-technology designs.
These characteristics make RO4003C® ideal for:
RF Components: Microstrip antennas, power amplifiers, filters, couplers
Automotive Systems: 24/77 GHz radar sensors, V2X communications
Wireless Infrastructure: 5G base station antennas, small cells, backhaul links
Satellite Communications: LNB/feed networks, phased arrays
High-Speed Digital: Server backplanes, high-data-rate interconnects
Industrial Sensors: IoT devices, industrial radar modules
RO4003C® delivers PTFE-level RF performance with FR-4-like manufacturability, establishing it as a versatile solution for commercial, automotive, and industrial applications demanding repeatable electrical properties, thermal robustness, and cost efficiency.
We offer a variety of high-frequency materials, including Rogers (e.g., RO4350B, RO5880), Taconic, and PTFE, depending on customer requirements.
Absolutely, we can provide detailed datasheets for review.
Our high-frequency PCBs can support frequencies up to 110 GHz, depending on the design and materials used.
We ensure precise impedance control through accurate stackup design, detailed impedance simulations, and advanced manufacturing processes.
Yes, we can combine materials like FR4 and high-frequency laminates for hybrid PCBs.
Restrictions mainly involve minimum trace width/spacing and material selection, depending on your design requirements.
We enhance thermal performance by using high thermal conductivity materials (e.g., metal-based PCBs) and optimizing copper thickness.
Thermal conductivity ranges from 0.2 W/m·K to 1.0 W/m·K, depending on the material.
ENIG/Gold Plating/Immersion Silver/Silver Plating/HASL/Gold finger/OSP/Nickel-palladium Gold/Resin plugging/Countersinking/ENIG+Hard Gold Plating/ImNi+ImTin/ENIG+OSP
ENIG is recommended due to its flat surface and excellent conductivity for high-frequency use.
We can produce high-frequency PCBs with layers ranging from 2 to 72.
Yes, we specialize in multilayer high-frequency PCBs and support hybrid stackup processes.
The thickness tolerance is ±0.05 mm, and the trace width tolerance is ±10%.
We perform impedance testing, RF performance testing, vacuum thermal testing, and more.
We achieve this by using high-quality materials, optimized manufacturing processes, and strict control of board thickness and other parameters.
Answer: Prototypes typically take 2–7 business days, while mass production takes 6–15 business days, depending on order volume and complexity.
High-frequency materials (e.g., Rogers) are more expensive, and higher layer counts increase complexity and cost.
We ensure reliability by using high-quality materials, rigorous testing, and optimized manufacturing processes.
Yes, our PCBs can endure temperatures up to 260°C and are suitable for harsh environments.
We use anti-static bags, vacuum packaging, and shockproof padding in the outer cartons for protection.
We provide air freight, express delivery, and sea shipping, depending on your needs, DHL is always prefered that ensure timely delivery through reliable logistics.
