Rogers 3006 is a ceramic-filled hydrocarbon laminate designed for high-frequency/high-speed applications. It features an ultra-low dissipation factor (Df ≈ 0.0025) and stable dielectric constant (Dk ≈ 6.15 @ 10 GHz), ensuring minimal signal loss and consistent impedance. Its glass-free construction eliminates Dk variations, supporting mmWave applications up to 77+ GHz. Additional advantages include low moisture absorption (<0.10%), excellent thermal management (low Z-axis CTE), RoHS compliance, and smooth copper adhesion. Key uses include automotive radar (77/79 GHz), 5G mmWave infrastructure, aerospace systems, and high-speed digital backplanes.
| Material | Rogers 4350b |
|---|---|
| Board Thickness | 1.524mm（60mil） |
| Copper Thickness | 1oz/1oz |
| Quanlity Standard | IPC-Ⅱ |
| Dielectric Constant (Dk) | 6.15 @10GHz |
| Dissipation Factor (Df) | 0.0020 @10GHz |
| Applications | |
| Surface Finish | ENIG 1u |
Rogers 3006 High-Frequency Laminates
Rogers 3006 is a ceramic-filled, hydrocarbon-based laminate and prepreg system engineered for superior high-frequency circuit performance. Key characteristics include:
Low Dielectric Loss: Extremely low dissipation factor (Df ≈ 0.0025 at 10 GHz) minimizes signal loss, making it ideal for high-speed digital and demanding RF/microwave applications.
Stable Dielectric Constant: Exhibits a stable relative dielectric constant (Dk ≈ 6.15 at 10 GHz) with minimal variation over frequency and temperature, ensuring consistent impedance control.
Low Moisture Absorption: Its hydrophobic nature results in very low moisture absorption (<0.10%), enhancing electrical stability in varying environmental conditions.
Excellent Thermal Management: Features a low coefficient of thermal expansion (CTE) in the Z-axis and good thermal conductivity, improving reliability under thermal cycling.
Halogen-Free & Lead-Free Compatible: Compliant with RoHS requirements and suitable for lead-free assembly processes.
Smooth Copper Surface: Provides excellent adhesion and enables fine-line etching for high-density interconnect (HDI) designs.
Glass-Free Construction: The absence of woven glass reinforcement eliminates the periodic variations in Dk associated with glass fabrics, crucial for millimeter-wave (mmWave) applications up to 77 GHz and beyond.
Rogers 3006 is widely used in automotive radar (especially 77/79 GHz), 5G infrastructure (mmWave), aerospace and defense systems, satellite communications, high-speed digital backplanes, and advanced test equipment where low loss, stable electrical properties, and reliability are paramount.
We offer a variety of high-frequency materials, including Rogers (e.g., RO4350B, RO5880), Taconic, and PTFE, depending on customer requirements.
Absolutely, we can provide detailed datasheets for review.
Our high-frequency PCBs can support frequencies up to 110 GHz, depending on the design and materials used.
We ensure precise impedance control through accurate stackup design, detailed impedance simulations, and advanced manufacturing processes.
Yes, we can combine materials like FR4 and high-frequency laminates for hybrid PCBs.
Restrictions mainly involve minimum trace width/spacing and material selection, depending on your design requirements.
We enhance thermal performance by using high thermal conductivity materials (e.g., metal-based PCBs) and optimizing copper thickness.
Thermal conductivity ranges from 0.2 W/m·K to 1.0 W/m·K, depending on the material.
ENIG/Gold Plating/Immersion Silver/Silver Plating/HASL/Gold finger/OSP/Nickel-palladium Gold/Resin plugging/Countersinking/ENIG+Hard Gold Plating/ImNi+ImTin/ENIG+OSP
ENIG is recommended due to its flat surface and excellent conductivity for high-frequency use.
We can produce high-frequency PCBs with layers ranging from 2 to 72.
Yes, we specialize in multilayer high-frequency PCBs and support hybrid stackup processes.
The thickness tolerance is ±0.05 mm, and the trace width tolerance is ±10%.
We perform impedance testing, RF performance testing, vacuum thermal testing, and more.
We achieve this by using high-quality materials, optimized manufacturing processes, and strict control of board thickness and other parameters.
Answer: Prototypes typically take 2–7 business days, while mass production takes 6–15 business days, depending on order volume and complexity.
High-frequency materials (e.g., Rogers) are more expensive, and higher layer counts increase complexity and cost.
We ensure reliability by using high-quality materials, rigorous testing, and optimized manufacturing processes.
Yes, our PCBs can endure temperatures up to 260°C and are suitable for harsh environments.
We use anti-static bags, vacuum packaging, and shockproof padding in the outer cartons for protection.
We provide air freight, express delivery, and sea shipping, depending on your needs, DHL is always prefered that ensure timely delivery through reliable logistics.
