RO4360G2 laminates are 6.15 dielectric constant, low loss, glass fiber reinforced, hydrocarbon resin ceramic filled thermoset materials that provide a better balance of performance and processability. RO4360G2 expands Rogers’ range of high performance materials by providing customers with a material that meets lead-free processes, enhances hardness to improve the processability of multilayer structures, and reduces both material and processing costs.
| Material | Rogers Ro4360G2 |
|---|---|
| Board Thickness | 0.635mm（25mil） |
| Copper Thickness | 2/2oz（70um） |
| Quanlity Standard | GJB362B |
| Dielectric Constant (Dk) | 6.15 @10GHz |
| Dissipation Factor (Df) | 0.0038 @10GHz |
| Applications | |
| Surface Finish | ENIG 1u |
RO4360G2 laminates are 6.15 dielectric constant, low loss, glass fiber reinforced, hydrocarbon resin ceramic filled thermoset materials that provide a better balance of performance and processability. RO4360G2 expands Rogers' range of high performance materials by providing customers with a material that meets lead-free processes, enhances hardness to improve the processability of multilayer structures, and reduces both material and processing costs.
RO4360G2 sheets are processed similar to FR-4 and are suitable for automated placement. They have a low Z-axis coefficient of thermal expansion for increased product design flexibility, and RO4360G2 has the same high glass transition temperature TG as all RO4000 series products. for multilayer designs, RO4360G2 sheets can be laminated with RO4400 semi-cured sheets and other low dielectric constant RO4000 series materials.
RO4360G2 laminates have a dielectric constant value of 6.15 (design value 6.4) allowing designers to downsize materials for applications where size and cost are critical. For engineers in RF fields such as power amplifiers, patch antennas and ground radar, RO4360G2 is the best value.
Features and Benefits:
RO4000 thermoset resin system specially formulated to meet a dielectric constant (DK) of 6.15.
-Easy processing similar to FR4
-RO4000 material reproducibility
-Low loss
-High thermal conductivity
-Lower overall cost compared to PTFE products
Low Z-axis coefficient of thermal expansion (CTE), high glass transition temperature (Tg)
-Multilayer structural design flexibility
High through-hole reliability
-Suitable for automated placement
Environmentally friendly
Meets lead-free processes
Worldwide regionalized finished goods inventory
-Shorter lead times and faster inventory turns
-Efficient supply chain
CAF Resistors
Typical Applications
-Base station power amplifiers
-Miniaturized transceivers
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We offer a variety of high-frequency materials, including Rogers (e.g., RO4350B, RO5880), Taconic, and PTFE, depending on customer requirements.
Absolutely, we can provide detailed datasheets for review.
Our high-frequency PCBs can support frequencies up to 110 GHz, depending on the design and materials used.
We ensure precise impedance control through accurate stackup design, detailed impedance simulations, and advanced manufacturing processes.
Yes, we can combine materials like FR4 and high-frequency laminates for hybrid PCBs.
Restrictions mainly involve minimum trace width/spacing and material selection, depending on your design requirements.
We enhance thermal performance by using high thermal conductivity materials (e.g., metal-based PCBs) and optimizing copper thickness.
Thermal conductivity ranges from 0.2 W/m·K to 1.0 W/m·K, depending on the material.
ENIG/Gold Plating/Immersion Silver/Silver Plating/HASL/Gold finger/OSP/Nickel-palladium Gold/Resin plugging/Countersinking/ENIG+Hard Gold Plating/ImNi+ImTin/ENIG+OSP
ENIG is recommended due to its flat surface and excellent conductivity for high-frequency use.
We can produce high-frequency PCBs with layers ranging from 2 to 72.
Yes, we specialize in multilayer high-frequency PCBs and support hybrid stackup processes.
The thickness tolerance is ±0.05 mm, and the trace width tolerance is ±10%.
We perform impedance testing, RF performance testing, vacuum thermal testing, and more.
We achieve this by using high-quality materials, optimized manufacturing processes, and strict control of board thickness and other parameters.
Answer: Prototypes typically take 2–7 business days, while mass production takes 6–15 business days, depending on order volume and complexity.
High-frequency materials (e.g., Rogers) are more expensive, and higher layer counts increase complexity and cost.
We ensure reliability by using high-quality materials, rigorous testing, and optimized manufacturing processes.
Yes, our PCBs can endure temperatures up to 260°C and are suitable for harsh environments.
We use anti-static bags, vacuum packaging, and shockproof padding in the outer cartons for protection.
We provide air freight, express delivery, and sea shipping, depending on your needs, DHL is always prefered that ensure timely delivery through reliable logistics.
